As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial. Four different lead-free and one eutectic lead-based solder alloys in BGA solder joints are characterised against their thermal fatigue lives (TFLs) to predict their mean-time-to-failure for preventive maintenance advice. Five finite elements (FE) models of the assemblies of the BGAs with the different solder alloy compositions are created with SolidWorks. The models are subjected to standard IEC 60749–25 temperature cycling in ANSYS mechanical package environment. Plastic strain, shear strain, plastic shear strain, and accumulated creep energy density responses of the solder joints are obtained and inputted into established life prediction models – Coffin Manson, Engelmaier, Solomon and Syed – to determine the lives of the models. SAC405 joints have the highest predicted TFL of circa 13.2 years, while SAC387 joints have the least life of circa 1.4 years. The predicted lives are inversely proportional to the magnitude of the areas of stress–strain hysteresis loops of the BGA solder joints. The prediction models are significantly not consistent in predicted magnitudes of TFLs across the solder joints. With circa 838% variation in the magnitudes of TFL predicted for Sn63Pb37, the damage parameters used in the models played a critical role and justifies that a combination of several failure modes drives solder joints damage. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. It proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.

随着温度循环驱动电子模块中焊点的疲劳失效，在关键任务系统中起作用的BGA焊点中不同焊料合金配方的热疲劳响应的表征变得至关重要。针对BGA焊点中的四种不同的无铅和一种共晶铅基焊料合金，根据其热疲劳寿命（TFL）进行特征分析，以预测其平均失效时间，以提供预防性维护建议。使用SolidWorks创建具有不同焊料合金成分的BGA组件的五个有限元（FE）模型。这些模型在ANSYS机械封装环境中经受了标准IEC 60749-25的温度循环。塑性应变，剪切应变，塑性剪切应变，获得焊点的累积蠕变能量密度响应，并将其输入到已建立的寿命预测模型（Coffin Manson，Engelmaier，Solomon和Syed）中，以确定模型的寿命。SAC405关节的预计TFL最高，约为13.2年，而SAC387关节的寿命最短，约为1.4年。预计寿命与BGA焊点的应力-应变滞后回线区域的大小成反比。预测模型在整个焊点的TFL预测幅度上明显不一致。对于Sn63Pb37，预测的TFL大小大约有838％的变化，模型中使用的损坏参数起着至关重要的作用，并证明几种故障模式的组合会驱动焊点损坏。这项研究提供了一种确定关键任务系统中BGA组件的预防性维护时间的技术。它提议基于损伤参数的组合来开发新的寿命预测模型，以改善预测效果。