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Microfibrous Mesh and Polymer Damping of Micromachined Vibration Isolators
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-03-04 , DOI: 10.1109/tcpmt.2021.3063854
Brent Bottenfield , Arthur Gernt Bond , Brian A. English , George T. Flowers , Robert N. Dean , Mark L. Adams

This article introduces the use of nickel (Ni) and copper (Cu) microfibrous meshes (MFMs) and Sorbothane and polydimethylsiloxane (PDMS) viscoelastic polymers to damp the dynamic response of a silicon micromachined vibration isolator (microisolator) for vibration reliability in mechanically harsh environments. The $9\times 9$ mm 2 microisolator is designed to house a small, packaged MEMS sensor to be isolated from the surrounding environment. Microisolators are fabricated from $\langle 100\rangle $ silicon-on-insulator (SOI) wafers using standard lithography and deep reactive ion etching (DRIE) procedures. The MFMs are attached to the microisolators post-fabrication via solder attachment. We then investigate the transmissibility of the undamped and damped vibration microisolators using laser Doppler vibrometry. The peak transmissibility of the microisolator is significantly reduced for all four cases of polymer or MFM damping. Experimental results are compared to the FEA simulated transmissibility and the analytically calculated transmissibility.

中文翻译:

微机械隔振器的微纤维网和聚合物阻尼

本文介绍了如何使用镍(Ni)和铜(Cu)微纤维网(MFM)以及Sorbothane和聚二甲基硅氧烷(PDMS)粘弹性聚合物来阻尼硅微机械隔振器(微隔振器)的动态响应,从而在机械恶劣的环境中实现振动可靠性。这 9美元/次9美元 mm 2微型隔离器旨在容纳一个小型,封装的MEMS传感器,以与周围环境隔离。微型隔离器由以下材料制成 $ \ langle 100 \ rangle $ 使用标准光刻和深反应离子刻蚀(DRIE)程序的绝缘体上硅(SOI)晶片。MFM通过焊锡附接在制造后的微隔离器上。然后,我们使用激光多普勒振动法研究无阻尼和阻尼振动微隔离器的透射率。对于聚合物或MFM阻尼的所有四种情况,微隔离器的峰值透射率都显着降低。将实验结果与FEA模拟的透射率和分析计算的透射率进行比较。
更新日期:2021-04-27
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