In some specific microelectronic applications, there is a demand for adhesive materials (glues/encapsulants) having very good thermal insulation properties. We have studied the properties obtained on epoxy-based samples loaded by several levels of xerogel filling. The thermal conductivity of these materials depends on the exact chemical composition and their manufacturing process. As a result, the thermal conductivity given in the manufacturer’s specifications or in the literature generally exhibits some dispersion. Therefore, we have developed a straightforward experimental rig, based on a vacuum chamber and miniature Pt100 sensors measurements, to precisely know the thermal conductivity of the various insulating materials used in the development and the assembly of select microsensors and microsystems. The results showed a decrease in the thermal conductivity of our xerogel-epoxy composites up to 35.8% compared with the value of the unfilled epoxy, corresponding to a thermal conductivity value of 107.9 mW m ⁻¹ K ⁻¹ . In addition, cross-sectional images were observed by optical microscopy to characterize the specific microstructure of each sample to relate these observations to improvements in thermal conductivity.

中文翻译：

---

电子应用的热绝缘碳干凝胶-环氧复合胶粘剂的制备与表征

在某些特定的微电子应用中，需要具有非常好的绝热性能的粘合材料（胶/密封剂）。我们已经研究了在几种干凝胶填充水平下加载的基于环氧的样品所获得的性能。这些材料的热导率取决于确切的化学成分及其制造工艺。结果，制造商的说明书或文献中给出的热导率通常表现出一定的分散性。因此，我们基于真空室和微型Pt100传感器的测量结果，开发了一种简单易用的实验装置，以精确了解在开发和组装选定的微传感器和微系统中使用的各种绝缘材料的热导率。 ^-1 K ^-1 。另外，通过光学显微镜观察横截面图像以表征每个样品的特定微观结构，以将这些观察结果与热导率的提高联系起来。