Commercial switchable filter banks are usually with bulky size; nowadays, they are highly preferred to feature compact size, self-packaging, and high integration. To meet these challenging requirements, this article proposes a micropackaged switchable filter bank for 3-D heterogeneous integration. The filters are stacked and integrated with switches using an in-house developed 3-D silicon process. These advanced silicon process steps mainly include through-silicon via (TSV), microelectromechanical systems (MEMS), and wafer-to-wafer bonding. To demonstrate this configuration and also meet industrial requirements, a four-channel switchable filter bank is designed, fabricated, and measured. Measurement results show that the chip module achieves a minimum insertion loss of 4.2 dB, including switch loss in the passbands, and a high isolation than 40 dB. To the best of the authors’ knowledge, this is the first demonstration of a fully integrated and micropackaged switchable filter chip in a 3-D TSV-MEMS process. Moreover, the size of the switchable filter bank is significantly reduced by 98.4%, i.e., it is reduced from $32\times 29.5\times7.5$ mm ³ of a typical industrial counterpart to $15\times 7.5\times1$ mm ³ of the proposed chip module.

中文翻译：

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3D TSV-MEMS工艺中具有高隔离度的微封装紧凑型可开关滤波器

商业可切换滤波器组通常体积庞大；如今，它们因具有紧凑的尺寸，自包装和高度集成的特性而受到高度青睐。为了满足这些具有挑战性的要求，本文提出了一种用于3D异构集成的微封装可切换滤波器组。使用内部开发的3-D硅工艺将滤波器堆叠并与开关集成在一起。这些先进的硅工艺步骤主要包括直通硅通孔（TSV），微机电系统（MEMS）和晶圆对晶圆的键合。为了演示此配置并满足工业要求，设计，制造和测量了四通道可切换滤波器组。测量结果表明，该芯片模块的最小插入损耗为4.2 dB，包括通带中的开关损耗，并且隔离度高于40 dB。据作者所知，这是3D TSV-MEMS工艺中完全集成且微封装的可切换滤波器芯片的首次演示。此外，可切换滤波器组的大小显着减小了98.4％，即从 $ 32 \倍29.5 \倍7.5 $ 典型工业零件的mm ³ $ 15 \次7.5 \次1 $ 建议的芯片模块的mm ³。