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Epoxy Anhydride Low-Combustibility Compositions for Impregnating Electronics Products
Polymer Science, Series D Pub Date : 2021-04-26 , DOI: 10.1134/s1995421221020337
I. V. Stroganov , V. F. Stroganov

Abstract

The possibility of improving the thermal impact resistance and dielectric performance at 100–125°C of epoxy diane resins cured with an anhydride curing agent by means of reactive plasticizers (flexibilizers) and hardeners is considered. The efficiency of using CKD-KTRA low-molecular carboxylate rubbers as flexibilizers is confirmed, as well as the efficiency of using the condensation product of monoglycidyl ether and diethyl amine with oleic and sebacic acids as a hardener. It is shown that diglycidyl ether based on tribromaniline reduces combustibility.



中文翻译:

浸渍电子产品的环氧酸酐低燃性组合物

摘要

考虑了通过反应性增塑剂(增韧剂)和硬化剂提高用酸酐固化剂固化的环氧二烷树脂在100–125°C时的耐热冲击性和介电性能的可能性。证实了使用CKD-KTRA低分子羧酸酯橡胶作为增韧剂的效率,以及使用单缩水甘油醚和二乙胺与油酸和癸二酸的缩合产物作为硬化剂的效率。结果表明,基于三溴苯胺的二缩水甘油醚降低了可燃性。

更新日期:2021-04-27
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