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Surface activation of poly(methyl methacrylate) for microfluidic device bonding through a H2O plasma treatment linked with a low-temperature annealing
Journal of Micromechanics and Microengineering ( IF 2.3 ) Pub Date : 2021-03-30 , DOI: 10.1088/1361-6439/abf034
Philip Nathaniel Immanuel , Chiang Chao-Ching , Chung-Rong Yang , Murugan Subramani , Tien-Hsi Lee , Song-Jeng Huang

This paper reports on a rapid, lossless process for the bonding of poly(methyl methacrylate) (PMMA) substrates for use in microfluidic devices for blood tests, utilizing H2O plasma, and H2O linked rapid thermal annealing (RTA) treatments. The bonding of PMMA produced with H2O plasma linked with RTA was analyzed, and its effect on the bonding of free radicals was investigated. The PMMA surface treatment was performed at constant RF power and H2O vapor flow but changing plasma treatment times in both processes. The surface modification of the PMMA subjected to the H2O plasma treatment was studied by optical emission spectroscopy, which confirmed that the relative intensity of hydroxyl radicals and oxygen emission peaks. The surface of the PMMA after being subjected to the plasma linked with RTA treatment was also characterized. The free energy increased with the plasma treatment time. The tensile test results revealed that the strength of OH bonds on the PMMA surface increased with a high plasma treatment time of 120 s. After bonding, UV–visible transmission spectrum measurements revealed that the transparency of the microfluidic device increased. We demonstrated the bonding of a microfluidic device with plasma treatment without deformation. This method provides an ideal bonding technique for the manufacture of microfluidic devices with PMMA. This technique has more advantages than other bonding techniques.



中文翻译:

通过与低温退火相关的 H2O 等离子体处理对用于微流控器件键合的聚(甲基丙烯酸甲酯)的表面活化

本文报道了一种使用 H 2 O 等离子体和 H 2 O 连接快速热退火 (RTA) 处理的用于血液检测微流控设备的聚甲基丙烯酸甲酯 (PMMA) 基材的快速、无损粘合工艺。分析了与RTA连接的H 2 O等离子体制备的PMMA的键合,并研究了其对自由基键合的影响。PMMA 表面处理是在恒定的射频功率和 H 2 O 蒸汽流量下进行的,但在两种工艺中都改变了等离子体处理时间。经受 H 2的 PMMA 的表面改性通过光学发射光谱研究了O 等离子体处理,证实了羟基自由基的相对强度和氧发射峰。还表征了经受与 RTA 连接的等离子体处理后的 PMMA 表面。自由能随着等离子体处理时间的增加而增加。拉伸试验结果表明,PMMA 表面的 OH 键强度随着 120 秒的高等离子体处理时间而增加。粘合后,紫外-可见透射光谱测量显示微流体装置的透明度增加。我们展示了微流控装置与等离子处理的结合,没有变形。该方法为使用 PMMA 制造微流体装置提供了一种理想的键合技术。该技术比其他键合技术具有更多优势。

更新日期:2021-03-30
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