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Ultrafast laser in fabrication of micro hemispherical resonators with quality factor over millions
Journal of Micromechanics and Microengineering ( IF 2.3 ) Pub Date : 2021-03-30 , DOI: 10.1088/1361-6439/abedcc
Yan Shi 1 , Kun Lu 1 , Bin Li 1 , Yimo Chen 1 , Xiang Xi 1 , Yulie Wu 1 , Xuezhong Wu 1, 2, 3 , Dingbang Xiao 1, 3
Affiliation  

Fused silica (FS) micro hemispherical resonators have attracted considerable interest for application in high-performance sensors. Manufacturing of resonators with extremely high quality factor and acceptable cost is currently the main challenge. Here, we demonstrate the application of ultrafast laser in manufacturing of three-dimensional (3D) FS micro hemispherical resonators with unrestricted edge shapes. The 3D FS structures fabricated from micro glassblowing are detached from substrates by direct laser ablation with amplification tines, which is useful for improving the performance of the resonators. Resonators fabricated from direct laser ablation are experimentally characterized, exhibiting quality factors over millions via electrostatically characterization. This is the first time that ultrafast lasers are exploited in the manufacturing of mechanical resonators, while obtaining satisfactory performance. Effective integration of the laser ablation into current devices will greatly improve the fabrication ability, generating important implications for future micro electronic devices.



中文翻译:

超快激光用于制造品质因数超过百万的微型半球谐振器

熔融石英 (FS) 微型半球谐振器在高性能传感器中的应用引起了极大的兴趣。制造具有极高品质因数和可接受成本的谐振器是目前的主要挑战。在这里,我们展示了超快激光在制造具有不受限制的边缘形状的三维 (3D) FS 微半球谐振器中的应用。由微玻璃吹制制成的 3D FS 结构通过带有放大尖齿的直接激光烧蚀与基板分离,这有助于提高谐振器的性能。由直接激光烧蚀制造的谐振器经过实验表征,通过静电表征表现出超过数百万的品质因数。这是首次将超快激光器用于机械谐振器的制造,同时获得了令人满意的性能。激光烧蚀与当前器件的有效集成将大大提高制造能力,对未来的微电子器件产生重要影响。

更新日期:2021-03-30
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