Transient liquid phase (TLP) bonding of Ti-6Al-4V/IN718 dissimilar joint was investigated using Cu interlayer at 950 °C for 5–45 min. The microstructure of the bonding zone was studied by using optical and scanning electron microscopes, energy dispersive spectroscopy, and X-ray diffraction analysis. Shear and microhardness tests were also used to evaluate the mechanical properties of the TLP joints. The results indicated that α-Ti, Ti₂Cu, and Ti₂Ni phases were formed in the athermally solidified zone of the joints. A Widmanstätten structure consisting of eutectoid mixture of α-Ti and Ti₂Cu was formed in the diffusion affected zone of Ti-6Al-4V side, and the formation of β(Nb) and NiTi eutectic and Cr₂Ti, FeTi, Ni₃Nb, Fe₅Nb₃, and Cu_0.035 Ni_0.565Ti_0.4 intermetallic compounds was predicted in the diffusion affected zone of IN718 side. The hardness values decreased in different bonding zones with extending the bonding time, while an inverse trend was observed in the athermally solidified zone. The maximum shear strength of 367 MPa was obtained. The morphology of the fracture surfaces of shear samples was investigated.

Ti-6Al-4V / IN718异种接头的瞬态液相（TLP）键在950°C下使用Cu夹层进行了5–45分钟的研究。通过使用光学和扫描电子显微镜，能量分散光谱和X射线衍射分析研究了键合区的微观结构。剪切和显微硬度测试也用于评估TLP接头的机械性能。结果表明，在接头的热固化区中形成了α-Ti，Ti ₂ Cu和Ti ₂ Ni相。在Ti-6Al-4V侧的扩散影响区中形成了由α-Ti和Ti ₂ Cu共析混合物组成的Widmanstätten结构，并形成了β（Nb）和NiTi共晶以及Cr ₂ Ti，FeTi，Ni ₃共晶。在IN718侧的扩散影响区中，预测到Nb，Fe ₅ Nb ₃和Cu _0.035 Ni _0.565 Ti _0.4金属间化合物。随着结合时间的延长，不同结合区的硬度值降低，而在非热固化区观察到相反的趋势。获得的最大剪切强度为367 MPa。研究了剪切样品的断裂表面的形态。