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Simulation Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2020-09-09 , DOI: 10.1109/temc.2020.3019438
Yin Sun 1 , Songping Wu 2 , Jianmin Zhang 2 , Chulsoon Hwang 1 , Zhiping Yang 2
Affiliation  

In this article, multilayer ceramic capacitors (MLCCs) induced acoustic noise is studied through simulation investigation of the vibration behavior of the printed circuit board (PCB). The board vibration theory is briefly summarized to understand the key parameters influencing intrinsic board vibration properties. The identified key parameters are the thickness, mass density, and Young's modulus of each board layer. To accommodate the parameter variations in real board fabrication process, a statistical simulation model for PCB vibration modal response is proposed. The simulation results have shown good correlation with the measurement. The sensitivity analysis of board vibration properties to the identified parameters of each layer has also been conducted through simulation. Based on the derived intrinsic board vibration properties, the PCB vibration behavior with capacitor as forced excitation is further analyzed through modal superposition. The simulated results also exhibit good correlation with measurement. With the proposed simulation methods, engineers can evaluate the board vibration behavior at early design stage and some design guidelines for placing MLCCs can be derived to reduce acoustic noise.

中文翻译:

移动系统配电网中多层陶瓷电容器引起的噪声仿真方法

在本文中,通过对印刷电路板(PCB)振动行为的仿真研究,研究了多层陶瓷电容器(MLCC)引起的声噪声。简要概述了板振动理论,以了解影响固有板振动特性的关键参数。确定的关键参数是每个板层的厚度,质量密度和杨氏模量。为了适应实际电路板制造过程中的参数变化,提出了PCB振动模态响应的统计仿真模型。仿真结果表明与测量具有良好的相关性。电路板振动特性对每层已确定参数的敏感性分析也已通过仿真进行。根据导出的固有板振动特性,通过模态叠加进一步分析了电容器在强制激励下的PCB振动行为。模拟结果也显示出与测量的良好相关性。利用提出的仿真方法,工程师可以在设计的早期阶段评估板的振动行为,并可以得出一些用于放置MLCC的设计准则,以减少声噪声。
更新日期:2020-09-09
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