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Microstructural characterization of alloyed palladium coated copper wire under high temperature
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2021-04-15 , DOI: 10.1016/j.microrel.2021.114125
Motoki Eto , Noritoshi Araki , Takashi Yamada , Masaaki Sugiyama , Shinji Fujimoto

Palladium coated copper (PCC) wire has been increasingly used in the semiconductor package in the last 10 years, especially in consumer products as a low-cost alternative to gold (Au) bonding wire. However, the PCC wire is still not widely used in the automotive industry due to the reliability limitations under a high temperature condition. In order to improve the long term reliability of PCC wire under a high temperature condition, new additive elements in the Cu core have been considered. In this paper, we investigate the role of additive elements in PCC wire and their effect on corrosion resistance under high temperature conditions. Pd and platinum (Pt) are examined as additive elements. Additive Pd and Pt in PCC wire become a cause of degradation for the stitch bond reliability under the high temperature condition due to the different degradation microstructure from conventional PCC wire.



中文翻译:

高温钯合金镀铜铜线的显微组织表征

在过去的十年中,涂钯铜(PCC)焊丝已越来越多地用于半导体封装中,尤其是在消费品中,它是金(Au)焊丝的低成本替代品。然而,由于高温条件下的可靠性限制,PCC导线仍未在汽车工业中广泛使用。为了提高高温条件下PCC线的长期可靠性,已考虑在Cu芯中添加新的添加元素。在本文中,我们研究了高温条件下PCC焊丝中添加元素的作用及其对耐蚀性的影响。钯和铂(Pt)作为添加元素进行了研究。

更新日期:2021-04-15
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