Abstract

The heat transfer in a contact–film–substrate system was analyzed under conditions in which the heat removal from a sample to the substrate is insufficient to avoid overheating of the sample. A method for increasing the heat removal from thin-film samples is proposed for low temperatures, when a high-density electric current passes through them. The property of an anomalously high thermal conductivity of copper at temperatures from 5 to 50 K is used as the main factor of the heat-sink intensification. The heat-conduction equation for the film–substrate system is solved numerically under the condition of an additional heat transfer to the potential contacts. It is shown that beryllium bronze contacts can provide an effective heat removal from samples of superconducting films in the resistive state under the conditions of a strong Joule heat release.

中文翻译：

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电阻状态下超导薄膜传热过程的模拟

摘要

在从样品到基材的散热量不足以避免样品过热的条件下，对接触膜-基材系统中的传热进行了分析。当低温下，当高密度电流通过薄膜样品时，提出了一种增加薄膜样品的散热的方法。铜在5至50 K的温度下异常高的导热性的特性被用作散热强化的主要因素。在额外的热量传递到潜在触点的条件下，通过数值求解了薄膜-衬底系统的导热方程。结果表明，在强烈的焦耳热释放条件下，铍青铜触点可以有效地从处于电阻状态的超导薄膜样品中除热。