In this article, the laser-based powder bed fusion (L-PBF) processing behavior of pure copper powder is evaluated by employing a conventional infrared fiber laser with a wavelength of 1080 nm, a small focal spot diameter of 37.5 µm, and power levels up to 500 W. It is shown that bulk solid copper parts with near full density (ρ _Archimedes = 99.3 ± 0.2%, ρ _Optical = 99.8 ± 0.1%) can be produced using a laser power of 500 W for the chosen combination of powder particle size, L-PBF settings, and pure copper baseplate. Moreover, at 500 W, parts with a relative density exceeding 99% are manufactured within a volumetric energy density window of 230–310 J/mm³, while laser power levels below 500 W did not produce parts with a relative density above 99%. An analytical model is used to elucidate the L-PBF processing behavior, wherein both conduction and keyhole regimes corresponding to the employed L-PBF settings are identified. The analytical model-based results predict that the bulk solid copper parts with near full density are produced in a keyhole regime prior to the onset of keyhole-induced porosity, which is in accordance with the porosity types observed in the parts. The L-PBF fabricated copper parts exhibit an electrical conductivity of 94 ± 1% compared to the international annealed copper standard (IACS) and demonstrate a tensile strength of 211 ± 4 MPa, a yield strength of 122 ± 1 MPa, and an elongation at break of 43 ± 3% in the as-built condition.

在本文中，通过使用波长为1080 nm，小焦点直径为37.5 µm和功率级的常规红外光纤激光器来评估纯铜粉的基于激光的粉末床熔合（L -PBF）处理行为高达500W。表明对于所选的粉末组合，使用500 W的激光功率可以生产出具有接近全密度（ρ_阿基米德 =  99.3±0.2％，ρ_光学 =  99.8±0.1％）的块状固态铜零件。粒径，L -PBF设置和纯铜基板。此外，在500 W功率下，相对密度超过99％的零件是在230–310 J / mm ³的体积能量密度窗口内制造的。，而低于500 W的激光功率不会产生相对密度高于99％的零件。使用分析模型来阐明L -PBF的处理行为，其中识别出与所采用的L -PBF设置相对应的传导和锁孔体制。基于分析模型的结果预测，在钥匙孔引起的孔隙率出现之前，会在钥匙孔状态下产生具有接近全密度的块状固态铜零件，这与零件中观察到的孔隙类型一致。在大号-PBF制成的铜零件与国际退火铜标准（IACS）相比具有94±1％的电导率，抗张强度为211±4 MPa，屈服强度为122±1 MPa，断裂伸长率为出厂状态下为43±3％。