The components used in electrical power engineering may undergo different aging mechanisms. For some material combinations, this includes interdiffusion processes together with the formation of intermetallic compounds (IMC). As for some IMCs only few or inconsistent data regarding growth parameters or electrical properties at temperatures below 200 °C exist, it is challenging to estimate their influence on the durability of electrical components. In a series of research projects, for the systems aluminium-copper (Al-Cu), aluminium-silver (Al-Ag), silver-tin (Ag-Sn) and nickel-tin (Ni-Sn) data on the formation and growth parameters were gathered. For this, the IMCs forming at temperatures below 200 °C were identified, synthesised and structurally and electrically characterised. Parallelly, industrial samples like busbars or fuse elements were analysed and the growth behaviour and rates of the IMCs were determined. For Al-Cu, three IMCs (Al₂Cu, AlCu and Al₄Cu₉) and for Ag-Al, two IMCs (Ag₂Al and Ag₃Al) could be identified. In Ag-Sn specimens, two IMCs (Ag₃Sn and Ag₄Sn) could be detected. Below 200 °C, Ni-Sn shows one IMC from the phase diagram (Ni₃Sn₄) and a second platelet shaped IMC which can be described as tetragonal NiSn₃. From the electrical properties and the growth rates of the IMCs together with the results of long-term tests it can be concluded, that the influence of IMCs on the overall life-cycle and electrical resistance is not significant.

电力工程中使用的组件可能会经历不同的老化机制。对于某些材料组合，这包括相互扩散过程以及金属间化合物（IMC）的形成。对于某些IMC，在温度低于200°C时，仅有很少或不一致的有关生长参数或电性能的数据，要估算它们对电气组件耐久性的影响是具有挑战性的。在一系列研究项目中，对于系统铝铜（Al-Cu），铝银（Al-Ag），银锡（Ag-Sn）和镍锡（Ni-Sn）数据的形成和收集生长参数。为此，鉴定，合成并在结构和电学特性上鉴定了在低于200°C的温度下形成的IMC。平行地 分析了诸如母线或保险丝元件之类的工业样品，并确定了IMC的生长行为和速率。对于Al-Cu，三个IMC（Al₂ Cu，AlCu和Al ₄ Cu ₉），对于Ag-Al，可以识别出两个IMC（Ag ₂ Al和Ag ₃ Al）。在Ag-Sn标本中，可以检测到两个IMC（Ag ₃ Sn和Ag ₄ Sn）。在200°C以下，Ni-Sn从相图中显示一个IMC（Ni ₃ Sn ₄）和第二个片状IMC，可以描述为四方NiSn ₃。从IMC的电特性和增长率以及长期测试的结果可以得出结论，IMC对整个生命周期和电阻的影响并不显着。