A through-plastic-via (TPV) three-dimensional (3D) integration approach is developed to integrate the organic field effect transistor (OFET) circuitry and the sensing/reference electrodes (SE/RE) for flexible bio-chemical sensor chips. Based on this approach, the SE can be fabricated using optimal processes on a different plastic substrate without concern of affecting the OFET part. Taking H ⁺ detection as a proof-of-concept, it is demonstrated that a weak ion response ( $\sim ~7$ mV induced by 0.2 pH) is amplified by 10 times through an integrated OFET common source amplifier. With close integration of the OFET amplifier and the SE, external noise influence can also be suppressed, beneficial for improving signal-to-noise ratio and improving the detection limit.

中文翻译：

---

集成有机场效应晶体管生化传感器芯片的全塑通孔三维集成

开发了一种通过塑料通孔（TPV）的三维（3D）集成方法，以集成有机场效应晶体管（OFET）电路和传感/参比电极（SE / RE），以用于柔性生化传感器芯片。基于这种方法，可以在不同的塑料基板上使用最佳工艺来制造SE，而不必担心影响OFET零件。以H ⁺检测为概念验证，表明离子响应较弱（ $ \ sim〜7 $ 通过集成的OFET共源放大器，将0.2 pH诱导的mV放大10倍。通过OFET放大器和SE的紧密集成，还可以抑制外部噪声影响，有利于提高信噪比和改善检测极限。