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Characterization of ABF/Glass/ABF Substrates for mmWave Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-02-23 , DOI: 10.1109/tcpmt.2021.3061485 Mutee ur Rehman , Siddharth Ravichandran , Atom O. Watanabe , Serhat Erdogan , Madhavan Swaminathan
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-02-23 , DOI: 10.1109/tcpmt.2021.3061485 Mutee ur Rehman , Siddharth Ravichandran , Atom O. Watanabe , Serhat Erdogan , Madhavan Swaminathan
Glass-based packaging presents unique opportunities for supporting 5G and beyond frequencies. In this work, we present the first broadband characterization results for the electrical properties of Ajinomoto build-up film (ABF) laminated on glass substrates. ABF/glass/ABF-based stack up has been characterized from 20 to 170 GHz. We also report the low-loss performance of ABF/glass/ABF transmission lines. The material stack up consists of a 100-
$\mu \text{m}$
-thick EN-A1 glass core from Asahi Glass Company (AGC) with 15-
$\mu \text{m}$ ABF GL102 laminated on both sides. Semiadditive process (SAP) has been used to metalize the stack up. A microstrip ring resonator (MRR) method has been used to extract the dielectric constant and loss tangent of the stack up. The dispersive model estimates the dielectric constant of the stack up to be ~4.72 for the entire frequency range with a variance of +0.1. The measured loss tangent values were 0.004, 0.009, and 0.012 at 23, 103, and 140 GHz, respectively. The electrical characterization results with a confidence interval of 95% have been reported. The average insertion loss for coplanar waveguide (CPW) lines in the frequency range was measured to be between 0.055 and 0.50 dB/mm. The average insertion loss for microstrip in the same frequency range was measured to be 0.12–0.62 dB/mm. Along with the good model to hardware correlation, the performance of the transmission lines has been compared with the insertion loss published for other substrate technologies.
中文翻译:
用于mmWave应用的ABF /玻璃/ ABF基板的特性
基于玻璃的包装为支持5G及更高频率提供了独特的机会。在这项工作中,我们展示了层压在玻璃基板上的味之素堆积膜(ABF)的电性能的第一个宽带表征结果。基于ABF /玻璃/ ABF的堆叠的特征是20至170 GHz。我们还报告了ABF /玻璃/ ABF传输线的低损耗性能。物料堆叠包括100- $ \ mu \ text {m} $
旭硝子公司(AGC)的厚EN-A1玻璃芯,其中15-
$ \ mu \ text {m} $ ABF GL102双面层压。半加成工艺(SAP)已用于使堆叠金属化。微带环形谐振器(MRR)方法已用于提取堆栈的介电常数和损耗角正切。色散模型在整个频率范围内估计堆栈的介电常数约为〜4.72,方差为+0.1。在23、103和140 GHz处测得的损耗角正切值分别为0.004、0.009和0.012。据报道,其电学表征结果的置信区间为95%。共平面波导(CPW)线在该频率范围内的平均插入损耗经测量在0.055至0.50 dB / mm之间。在相同频率范围内,微带的平均插入损耗测得为0.12-0.62 dB / mm。加上与硬件相关的良好模型,
更新日期:2021-03-23
中文翻译:
用于mmWave应用的ABF /玻璃/ ABF基板的特性
基于玻璃的包装为支持5G及更高频率提供了独特的机会。在这项工作中,我们展示了层压在玻璃基板上的味之素堆积膜(ABF)的电性能的第一个宽带表征结果。基于ABF /玻璃/ ABF的堆叠的特征是20至170 GHz。我们还报告了ABF /玻璃/ ABF传输线的低损耗性能。物料堆叠包括100-