Chip peeling-off, mainly accomplished through the cooperation of needle-ejecting and vacuum-absorbing, plays a critical role in chip transferring process. However, there are few studies involving the quantification of process parameters, such as optimal needle position, needle force or displacement, to access to a reliable chip peeling. In this paper, optimization criteria for a high success rate of thin chip peeling-off are presented. With the cooperation of multi-needle-ejecting and vacuum-absorbing, the chip-adhesive-substrate structure is modeled within the framework of Timoshenko’s beam theory, and the competing fracture behavior between chip cracking and peeling-off in the peeling process is analyzed. A dimensionless peeling health index $\mathrm{\Gamma }$is proposed to evaluate the health status of the chip in the peeling process, and the effects of the needle position, the chip-adhesive-substrate structure geometry and material on the peeling health index are examined. On a basis of the numerical results, the optimal conditions for high-productivity peeling are achieved, which are the optimal needle position roughly at the edges of the chip, and the optimal shift point of changing the condition from needle-ejecting to vacuum-absorbing where the crack length in the adhesive layer expands to nearly the half value of the chip length. In addition, the expressions of the optimal ejecting needle force/displacement corresponding to the optimal shift point are obtained by the dimensionless analysis and fitting method. Furthermore, the optimization criteria including the optimal needle position and the optimal shift point of changing the condition from needle-ejecting to vacuum-absorbing are verified by experiments.

切屑的剥离主要通过针头喷射和真空吸收的配合来完成，在切屑转移过程中起着至关重要的作用。但是，很少有研究涉及量化工艺参数（例如最佳针位置，针力或位移）以获取可靠的切屑剥落。在本文中，提出了成功实现薄芯片剥离成功率的优化标准。在多针喷射和真空吸收的配合下，在蒂莫申科束理论的框架内对芯片-粘合剂-基材结构进行了建模，并分析了剥离过程中芯片开裂与剥离之间的竞争性断裂行为。无量纲的脱皮健康​​指数$\mathrm{\Gamma }$提出了在剥皮过程中评估切屑健康状况的方法，并研究了针头位置，切屑-粘合剂-基材结构的几何形状和材料对剥落健康指数的影响。根据数值结果，获得了高效率剥离的最佳条件，即大致在切屑边缘处的最佳针位置，以及将条件从排针改变为真空吸收的最佳转移点。粘合剂层中的裂纹长度扩展到接近芯片长度的一半。另外，通过无量纲分析和拟合方法获得与最佳换档点相对应的最佳顶针力/位移的表达式。此外，