The relationship between prepreg tack and the degree of intimate contact (DoIC) between prepreg and a rigid substrate was explored in the context of a continuous application-and-peel test method. Tack for a unidirectional prepreg tape was characterised for different surface combinations and varying test parameters (material feed rate, temperature) at a constant compaction pressure. Application of the prepreg to a transparent rigid substrate (glass), was carried out at matching test conditions to the prepreg tack measurements. Optical microscopy was utilised to acquire images of the contact area at the prepreg-glass interface. Image analysis of the micrographs enabled quantification of the contact area. The time- and temperature-dependent viscoelastic behaviour of the resin was explored directly on the prepreg using oscillatory parallel plate rheometry, and time-temperature superposition was applied to construct both tack and DoIC master curves. The shifted DoIC data showed that true contact area increases with decreasing shifted feed rates, until maximum contact area is achieved. Similarly, tack increases with decreasing shifted feed rates. However, at a critical feed rate, the bond failure mechanism switches from adhesive to cohesive failure. In cohesive failure, tack decreases with decreasing feed rate despite the high levels of DoIC.

在连续施加和剥离试验方法的背景下，探讨了预浸料的粘性与预浸料和刚性基材之间的紧密接触程度（DoIC）之间的关系。单向预浸料带的粘性在恒定压实压力下具有不同的表面组合和变化的测试参数（材料进料速率，温度）。将预浸料施加到透明的刚性基材（玻璃）上是在与预浸料粘性测量相匹配的测试条件下进行的。利用光学显微镜来获取预浸料-玻璃界面处的接触区域的图像。显微照片的图像分析可以量化接触面积。使用振荡平行板流变仪直接在预浸料上探索树脂的时间和温度相关的粘弹性行为，并应用时间-温度叠加来构建粘性和DoIC主曲线。偏移的DoIC数据表明，真正的接触面积随偏移进给速率的降低而增加，直到达到最大接触面积。同样，粘性随着进给速度的降低而增加。但是，在临界进给速度下，粘结破坏机制会从粘合剂破坏变为内聚破坏。在内聚破坏中，尽管DoIC含量很高，但随着进给速度的降低，粘性会降低。直到达到最大接触面积。同样，粘性随着进给速度的降低而增加。但是，在临界进给速度下，粘结破坏机制会从粘合剂破坏变为内聚破坏。在内聚破坏中，尽管DoIC含量很高，但随着进给速度的降低，粘性会降低。直到达到最大接触面积。同样，粘性随着进给速度的降低而增加。但是，在临界进给速度下，粘结破坏机制会从粘合剂破坏变为内聚破坏。在内聚破坏中，尽管DoIC含量很高，但随着进给速度的降低，粘性会降低。