In the present work, the quality factor (and thermoelastic damping) of a microbeam resonator is analyzed by employing the three-phase-lag thermoelasticity theory with memory-dependent derivative. We compare our results with different heat conduction models. An explicit formula of thermoelastic damping has been derived, and effects of the normalized frequency and the beam height on thermoelastic damping of the microbeam resonator have been studied. We presented our work numerically by taking Silicon. The effects of normalized frequency, beam height, and different kernel of memory-dependent derivative on thermoelastic damping has been presented with the numerical data of Silicon.

在目前的工作中，通过使用具有记忆相关导数的三相滞后热弹性理论来分析微束谐振器的品质因数（和热弹性阻尼）。我们将结果与不同的热传导模型进行比较。推导了一个明确的热弹性阻尼公式，并研究了归一化频率和波束高度对微束谐振器热弹性阻尼的影响。我们通过采用硅材料以数字方式展示了我们的工作。利用硅的数值数据，给出了归一化的频率，束高和不同的依赖于记忆的导数的核对热弹性阻尼的影响。