Security problems of microsystem have gained widespread attention for its applications in many fields. However, current integration technologies cannot provide a security solution against physical invasive attack and side channel attack effectively. In this paper, a novel silicon interposer structure with embedded trenches was proposed to achieve high security microsystem integration. Chips were embedded in the trenches with metal shielding wires protected in all directions, which formed a Faraday cage. Experiment indicated that the Faraday cage could shield the electromagnetic radiation of the chips dramatically and the electromagnetic based side channel attack could be mitigated. Besides, metal shielding wires also formed a loop. Physical invasive attack on the chips would unavoidably damage the loop and could be detected. Since fine pitch random Hamiltonian metal wires could be fabricated on the silicon interposer, the designed structure had a high detection resolution.

微系统的安全性问题已经在许多领域得到了广泛的关注。但是，当前的集成技术不能有效地提供针对物理侵入攻击和侧信道攻击的安全解决方案。本文提出了一种具有嵌入式沟槽的新型硅中介层结构，以实现高安全性的微系统集成。芯片被嵌入到沟槽中，金属屏蔽线在各个方向都受到保护，从而形成了法拉第笼。实验表明，法拉第笼可以显着屏蔽芯片的电磁辐射，并且可以减轻基于电磁的侧通道攻击。除此之外，金属屏蔽线也形成了一个回路。对芯片的物理侵入攻击将不可避免地损坏环路并可以被检测到。