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High performance thermal link with small spring constant for cryogenic applications
Cryogenics ( IF 2.1 ) Pub Date : 2021-03-09 , DOI: 10.1016/j.cryogenics.2021.103280
Tomohiro Yamada , Takayuki Tomaru , Toshikazu Suzuki , Takafumi Ushiba , Nobuhiro Kimura , Suguru Takada , Yuki Inoue , Takaaki Kajita

We developed a soft and high thermal conductive thermal link for cryogenic applications. The measured maximum thermal conductivity was approximately 18500 W/m/K at 10 K. This spring constant was 1/43 of that of a single thick wire with the same cross-sectional area at room temperature. We reached these performances by utilizing high purity aluminum (99.9999%, 6 N) and by stranding many thin wires that are 0.15 mm in diameter. The electrical Residual Resistivity Ratio was also measured and used to estimate the thermal conductivity by the Wiedemann–Franz law. We observed the size effect on the electrical conductivity, and evaluated the effect of mechanical deformation to the RRR. These evaluations allow us to design a pragmatic thermal link for cryogenic application.



中文翻译:

高性能热连接,弹簧常数小,适用于低温应用

我们为低温应用开发了一种软而高导热的热链接。测得的最大热导率约为18500 w ^//ķ弹簧常数为10K。该弹簧常数是室温下具有相同横截面积的单根粗线的弹簧常数的1/43。我们通过使用高纯铝(99.9999,6 N)并通过绞合许多直径为0.15毫米的细线。电阻率也可以通过Wiedemann-Franz定律进行测量,并用于估算导热率。我们观察了尺寸对电导率的影响,并评估了机械变形对RRR的影响。这些评估使我们能够设计用于低温应用的实用热连接。

更新日期:2021-04-15
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