We analyze the thermoelectric cooling properties of a Corbino device in the quantum Hall regime on the basis of experimental data of electrical conductance. We focus on the cooling power and the coefficient of performance within and beyond linear response. Thermovoltage measurements in this device reported by Real et al., [Phys. Rev. Appl. 14, 034019 (2020)] indicated that the transport takes place in the diffusive regime, without signatures of effects due to the electron-phonon interaction in a wide range of temperatures and filling factors. In this regime, the heat and charge currents by electrons can be described by a single transmission function. We infer this function from experimental data of conductance measurements and we calculate the cooling power and the coefficient of performance for a wide range of filling factors and temperatures, as functions of the thermal and electrical biases. We predict an interesting cooling performance in several parameter regimes.

中文翻译：

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量子霍尔Corbino器件的热电冷却特性

我们根据电导率的实验数据分析了在霍尔效应中Corbino器件的热电冷却特性。我们专注于线性响应之内和之外的冷却能力和性能系数。Real等人报告了此设备中的热电压测量。，[物理 Rev. Appl。 14，034019（2020）]指出，传输是在扩散状态下进行的，没有在宽泛的温度和填充因子下由于电子与声子相互作用而产生的影响的信号。在这种情况下，电子的热和电荷电流可以用一个传递函数来描述。我们从电导率测量的实验数据推断出该函数，并根据热和电偏置的函数，计算了各种填充因子和温度下的冷却功率和性能系数。我们预测了几个参数范围内的有趣的冷却性能。