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Effect of Bonding Time on Dissimilar Transient Liquid Phase (TLP) Bonding of IN939 to IN625 Superalloys: Microstructural Characterization and Mechanical Properties
Metallurgical and Materials Transactions A ( IF 2.8 ) Pub Date : 2021-03-02 , DOI: 10.1007/s11661-021-06176-x
Amirhossein Sadeghian , Seyyed Ehsan Mirsalehi , Farzam Arhami , Ahmad Malekan , Noritaka Saito , Kunihiko Nakashima

The microstructure and mechanical properties of transient liquid phase (TLP) bonded joints between dissimilar precipitation hardened IN939 and solid solution hardened IN625 with a Ni-Cr-Si-Fe-B filler alloy were studied. The TLP bonding was conducted in different bonding times (i.e., 15, 25, 35, 45, 60, and 90 minutes). Different phases, formed in the isothermally solidified zone (ISZ), on-cooling solidified zone, and diffusion affected zone (DAZ), were characterized using EDS, XRD, and EPMA analyses. A Ni-rich γ solid solution, CrB, and Ni3B were detected in the centerline of samples with incomplete isothermal solidification (i.e., 15 and 25 minutes), formed by binary and ternary eutectic reactions. Raising the time of bonding boosted isothermal solidification, resulting in a joint without deleterious eutectic microconstituents in bonding times of 35 minutes and higher. Chromium-rich borides were discovered in the DAZ of IN939, while the IN625-DAZ side was composed of chromium-molybdenum-rich borides. The concentration of alloying elements in the ISZ experienced an increment by further raising the bonding time to 90 minutes, creating a more homogenous bond with increased ISZ microhardness and mechanical properties. The highest shear strength (~ 92 and ~ 77 Pct that of the IN939 and IN625, respectively) and failure energy were attained for the 90-minutes sample. The fracture mechanism was also switched from a brittle semi-cleave morphology to a more ductile dimple-like morphology by increasing the bonding time from 15- to 90-minutes.



中文翻译:

键合时间对IN939与IN625高温合金异种瞬态液相(TLP)键合的影响:微观结构表征和力学性能

研究了用Ni-Cr-Si-Fe-B填充合金在异种沉淀硬化IN939和固溶硬化IN625之间的瞬态液相(TLP)键合接头的组织和力学性能。在不同的粘合时间(15、25、35、45、60和90分钟)中进行TLP粘合。使用EDS,XRD和EPMA分析对在等温凝固区(ISZ),冷却凝固区和扩散影响区(DAZ)中形成的不同相进行了表征。甲富Ni γ固溶体,的CrB和Ni 3 B在与不完全等温凝固的样本的中心线检测(,15分钟和25分钟),由二元和三元共晶反应形成。增加键合时间可促进等温固化,从而在35分钟及更长的键合时间内形成无有害共晶微成分的接头。在IN939的DAZ中发现了富含铬的硼化物,而IN625-DAZ一侧则由富含铬-钼的硼化物组成。通过将结合时间进一步提高到90分钟,ISZ中合金元素的浓度得到了增加,从而产生了更加均一的结合,同时提高了ISZ的显微硬度和机械性能。90分钟的样品获得了最高的剪切强度(分别为IN939和IN625的约92和77 Pct)和破坏能量。

更新日期:2021-03-02
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