Purpose

The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.

Design/methodology/approach

Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.

Findings

It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.

Originality value

It is confirmed.

中文翻译：

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老化温度对电子系统焊点热机械疲劳寿命的影响

目的

本研究的目的是研究老化温度对电子设备桶形焊点寿命的影响，并将这些影响包括在修改后的预测模型中。

设计/方法/方法

在不同的应力幅度和老化温度下进行了几次加速剪切应力测试。

发现

发现随着时效温度升高，寿命降低。当考虑到时效温度时，Morrow 能量模型也被认为是最好的预测模型。

原创价值

已确认。