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Interfacial Properties of nMOSFETs With Different Al2O3 Capping Layer Thickness and TiN Gate Stacks
IEEE Transactions on Electron Devices ( IF 3.1 ) Pub Date : 2021-01-15 , DOI: 10.1109/ted.2020.3047356
Danghui Wang , Tianhan Xu , Eddy Simoen , Bogdan Govoreanu , Cor Claeys , Yang Zhang

In this article, the interfacial properties of nMOSFETs with different thickness high- $\kappa $ Al 2 O 3 capping layer on an 8-nm SiO 2 and TiN gate stacks have been investigated using electrical measurement and low-frequency noise at room temperature. It is shown that the predominant 1/ ${f}$ noise is governed by the number fluctuations mechanism. It is indicated that: 1) presence of an Al 2 O 3 capping layer increases the noise power spectral density and, hence, the oxide trap density has an influence on the low-field mobility further and 2) effective work-function and the threshold voltage of nMOSFET should be modulated using the high- $\kappa $ Al 2 O 3 capping layers.

中文翻译:

具有不同Al 2 O 3盖层厚度和TiN栅叠层的nMOSFET的界面特性

在本文中,具有不同厚度的nMOSFET的界面特性 $ \ kappa $ 使用电学测量和室温下的低频噪声,已经研究了8 nm SiO 2和TiN栅叠层上的Al 2 O 3覆盖层 。结果表明,主要的1 / $ {f} $ 噪声由数量波动机制控制。结果表明:1)Al 2 O 3覆盖层的存在增加了噪声功率谱密度,因此,氧化物阱的密度进一步影响了低场迁移率; 2)有效功函数和阈值nMOSFET的电压应使用高 $ \ kappa $ Al 2 O 3覆盖层。
更新日期:2021-02-26
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