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An apparatus for the continuous measurement of thickness during the electropolishing of superconducting cavities
Review of Scientific Instruments ( IF 1.6 ) Pub Date : 2021-02-24 , DOI: 10.1063/5.0028778
M. Bertucci 1 , A. Bosotti 1 , R. Campari 2 , A. D’Ambros 1 , A. Gresele 3 , A. T. Grimaldi 1 , P. Michelato 1 , L. Monaco 1 , C. Pagani 1 , R. Paparella 1 , N. C. Pistoni 2 , M. Rizzi 3 , D. Sertore 1 , A. Torri 3
Affiliation  

An apparatus allowing continuous acquisition of thickness measurements during electropolishing of superconducting cavities is described. The instrument is based on the ultrasound thickness measurement technique and allows the connection of up to six probes. The apparatus has been employed to monitor the surface treatment of PIP-II low beta single cell prototypes developed and manufactured by LASA-INFN and specifically to measure surface removal at different points of interest on the cavity surface. The apparatus facilitated the development and optimization of electropolishing parameters for incorporation into the cavity manufacturing process.

中文翻译:

一种在超导腔体电抛光过程中连续测量厚度的设备

描述了一种在超导腔体的电抛光过程中允许连续获取厚度测量值的设备。该仪器基于超声波测厚技术,最多可连接六个探头。该设备已被用于监测由LASA-INFN开发和制造的PIP-II低β单细胞原型的表面处理,特别是用于测量腔体表面上不同关注点的表面去除。该设备促进了电抛光参数的开发和优化,以结合到型腔制造过程中。
更新日期:2021-02-26
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