Abstract

Data on gluing of various nonmetallic materials, as well as dissimilar materials with different TLEC values using Viksint U-2-28 and Viksint U-10-80 organosilicon sealants, as well as Elasil 137-175M organosilicon adhesive sealant, are given. It is shown that adhesive joints of dissimilar materials with different TLEC values could resist impact and pulse loads upon operation, while adhesive joints of nonmetallic materials operate under bending loads.

中文翻译：

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使用密封胶粘合异种材料

摘要

给出了使用Viksint U-2-28和Viksint U-10-80有机硅密封胶以及Elasil 137-175M有机硅粘合剂密封胶对各种非金属材料以及具有不同TLEC值的异种材料进行胶合的数据。结果表明，具有不同TLEC值的异种材料的粘合接头在操作时可以抵抗冲击和脉冲载荷，而非金属材料的粘合接头则在弯曲载荷下起作用。