The present study aims at the experimental and numerical investigations of the Paraffin wax-based mini-channels for the performance enhancement of seven high heat-generating IC chips under the natural convection heat transfer mode. Two mini-channels (left and right) are fabricated at the periphery of the substrate board and are filled with the Paraffin wax. The IC chips are placed adjacent to these channels and supplied with non-uniform heat inputs leading to the constant volumetric heat generation in the ranges of 0.4 × 10⁷–1 × 10⁷ W/m³. The numerical analysis is carried out to support the experiments and it is seen that both the results match well with each other within the IC chip temperature variation of 4–5 °C. The temperature of the IC chips is reduced by 37.34–45.79% using the Paraffin wax and thus enhances their performance by 2.33–4.63 times. This confirms the significance of Paraffin wax for the cooling of the IC chips and ultimately enhances the system performance and reliability.

本研究旨在对基于石蜡蜡的微通道进行自然对流换热模式下的七个高发热IC芯片性能增强的实验和数值研究。在基板的外围制造了两个微型通道（左和右），并填充了石蜡。IC芯片与这些通道相邻放置，并提供不均匀的热量输入，导致恒定的体积热量产生，范围为0.4×10 ⁷ –1×10 ⁷  W / m ³。进行了数值分析以支持实验，结果表明，在4-5°C的IC芯片温度范围内，两个结果相互匹配。使用石蜡可将IC芯片的温度降低37.34–45.79％，从而将其性能提高2.33–4.63倍。这证实了石蜡对IC芯片冷却的重要性，并最终提高了系统性能和可靠性。