In this paper, a TC4/ 304 plate was successfully manufactured by electrically-assisted rolling (EA rolling). Under the constant pulse current, the effect of EA rolling on the interfacial structure and interfacial bonding strength of TC4/304 plates was systematically studied at different rolling reduction ratios of 19.5%, 38% and 58% at 750 °C and at reduction ratios of 58% when the rolling temperatures were 650 °C, 750 °C and 850 °C. The microinterface and shear fracture surface were analysed by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) was employed to determine the formation of the phase. The interfacial bonding properties of the plates were tested by tensile shear. The results show that under action of pulse current, the tensile shear strength of the TC4/304 plate is the highest at 750℃×38%, reaching 286 MPa. Insufficient element diffusion caused by small reduction ratio and Kirkendall micro voids caused by diffusion acceleration with large reduction lead to the decrease of tensile shear strength. When the reduction ratio is 58%, the tensile shear strength reaches 239 MPa at 650 ℃. Kirkendall micro voids at 750 ℃ and the intermetallic compounds at 850 ℃ lead to the continuous decrease of shear strength. EA rolling is the primary factor that lead to the substantial increase in the interface bonding strength of the TC4/304 plate at low temperature and small deformation.

在本文中，通过电辅助轧制（EA轧制）成功地制造了TC4 / 304板。在恒定的脉冲电流下，系统地研究了EA轧制对TC4 / 304板的界面结构和界面结合强度的影响，在750°C下轧制率为19.5％，38％和58％的不同轧制率以及当轧制温度为650°C，750°C和850°C时为58％。通过扫描电子显微镜（SEM）和能量分散光谱（EDS）分析了微界面和剪切断裂表面，并使用X射线衍射（XRD）确定了相的形成。通过拉伸剪切来测试板的界面粘结性能。结果表明，在脉冲电流作用下，TC4 / 304板的拉伸剪切强度在750℃×38％时最高，达到286 MPa。较小的还原率导致的元素扩散不足，以及较大的还原率导致的扩散加速导致的Kirkendall微空隙导致拉伸剪切强度降低。当压下率为58％时，在650℃时拉伸剪切强度达到239 MPa。750℃的Kirkendall微孔和850℃的金属间化合物导致剪切强度连续降低。EA轧制是导致TC4 / 304板在低温和小变形下的界面粘结强度大幅提高的主要因素。较小的还原率导致的元素扩散不足，以及较大的还原率导致的扩散加速导致的Kirkendall微空隙导致拉伸剪切强度降低。当压下率为58％时，在650℃时拉伸剪切强度达到239 MPa。750℃的Kirkendall微空隙和850℃的金属间化合物导致剪切强度连续降低。EA轧制是导致TC4 / 304板在低温和小变形下的界面粘结强度大幅提高的主要因素。较小的还原率导致的元素扩散不足，以及较大的还原率导致的扩散加速导致的Kirkendall微空隙导致拉伸剪切强度降低。当压下率为58％时，在650℃时拉伸剪切强度达到239 MPa。750℃的Kirkendall微孔和850℃的金属间化合物导致剪切强度连续降低。EA轧制是导致TC4 / 304板在低温和小变形条件下界面粘结强度大幅提高的主要因素。