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Numerical investigations of heat transfer in hybrid microchannel heat sink with multi-jet impinging and trapezoidal fins
International Journal of Thermal Sciences ( IF 4.5 ) Pub Date : 2021-02-20 , DOI: 10.1016/j.ijthermalsci.2021.106902
W. Gao , J.F. Zhang , Z.G. Qu , W.Q. Tao

With the continued improvement in integration and power density of electronic devices, it is difficult to simultaneously achieve excellent temperature uniformity and cooling performance with the increasing heat flux of electronic component. Herein, a multi-jet impinging system with trapezoidal fins and secondary channels, which can be used to efficiently cool the electronic component, is proposed. The effects of different jet arrangement patterns and geometric parameters on heat transfer in the heat sinks were investigated through numerical simulations. Individual parameter analysis was conducted, and the numerical results provided deep insight into heat transfer and flow mechanism. The unilateral jet arrangement patterns yielded larger heat transfer coefficients and pressure drops, but the bilateral jet arrangement pattern exhibited better comprehensive performance. The jet patterns with quasi-symmetric flow and heat transfer features showed a better dissipation performance, and the temperature difference of the heated surface was <5.5 K with a heat flux of 200 W/cm2. To investigate the influences of the parameters comprehensively, the Taguchi optimization method was subsequently employed to analyze their effects on the pressure drop, heat transfer coefficient, and overall performance. Finally, the optimal parameter combinations and contribution ratios were obtained. The jet pattern and fin angle demonstrated the largest and smallest degrees of influence, respectively, among the optimization objectives. The proposed hybrid heat sink exhibited a better comprehensive performance than other types of heat sinks owing to the small product of the thermal resistance and pump power. The study provides a valuable perspective on multi-jet impinging system for electronic device cooling.



中文翻译:

带有多射流冲击和梯形翅片的混合微通道散热器传热的数值研究

随着电子设备的集成度和功率密度的不断提高,随着电子部件的热通量的增加,难以同时实现优异的温度均匀性和冷却性能。在此,提出了一种具有梯形翅片和次级通道的多喷嘴冲击系统,该系统可用于有效地冷却电子部件。通过数值模拟研究了不同的射流布置方式和几何参数对散热器内传热的影响。进行了单独的参数分析,并且数值结果提供了对热传递和流动机理的深入了解。单边射流布置模式产生更大的传热系数和压降,但是双边喷射方式表现出更好的综合性能。具有准对称流动和传热特性的射流模式表现出更好的散热性能,受热表面的温差<5.5 K,热通量为200 W / cm2。为了全面研究这些参数的影响,随后采用了Taguchi优化方法来分析它们对压降,传热系数和整体性能的影响。最后,获得了最优的参数组合和贡献率。在优化目标中,射流模式和鳍角分别显示出最大和最小的影响程度。由于热阻和泵浦功率的乘积较小,因此提出的混合散热器表现出比其他类型的散热器更好的综合性能。该研究为电子设备冷却的多喷嘴撞击系统提供了有价值的观点。

更新日期:2021-02-21
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