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Radiative Recombination at Ion-Induced Defects in Cu(In,Ga)Se 2 Alloy Thin Films
Semiconductors ( IF 0.7 ) Pub Date : 2021-02-19 , DOI: 10.1134/s1063782621020093
O. M. Borodavchenko , V. D. Zhivulko , A. V. Mudryí , M. V. Yakushev , I. A. Mogilnikov

Abstract

Radiation-induced effects in Cu(In,Ga)Se2 alloy thin films after implantation with hydrogen ions with energies of 2.5, 5, and 10 keV and a dose of ~3 × 1015 cm–2 are studied. Comparative analysis of the optical characteristics of nonimplanted and hydrogen-implanted Cu(In,Ga)Se2 films is conducted on the basis of photoluminescence spectra and luminescence-excitation spectra recorded at liquid-helium temperature (~4.2 K). The band gap determined for Cu(In,Ga)Se2 alloys by mathematical processing of the luminescence-excitation spectra is ~1.171 eV. In the photoluminescence spectra of nonimplanted and hydrogen-implanted Cu(In,Ga)Se2 films, an intense band is detected, with a maximum at ~1.089 eV. The band is defined by the recombination of free electrons with holes localized in the valence-band tails. It is established that broad bands with maximums at the energies 0.92 and ~0.77 eV are defined by the radiative recombination of nonequilibrium charge carriers at deep energy levels of ion-induced acceptor defects formed in the band gap of Cu(In,Ga)Se2 alloys. The conditions for the effect of the ion passivation of dangling electron bonds at the surface and in the bulk of polycrystalline Cu(In,Ga)Se2 films and the nature of structural point defects and the mechanisms of radiative recombination are discussed.



中文翻译:

Cu(In,Ga)Se 2合金薄膜中离子诱导缺陷的辐射复合

摘要

研究了以2.5、5和10 keV能量和〜3×10 15 cm –2的能量注入氢离子后,Cu(In,Ga)Se 2合金薄膜中的辐射诱导效应。基于液氦温度(〜4.2 K)下记录的光致发光光谱和发光激发光谱,对未注入和氢注入的Cu(In,Ga)Se 2薄膜的光学特性进行了比较分析。通过发光激发光谱的数学处理确定的Cu(In,Ga)Se 2合金的带隙为〜1.171 eV。在未注入和氢注入的Cu(In,Ga)Se 2的光致发光光谱中在电影中,检测到一个强烈的带,最大值在〜1.089 eV。该带由自由电子与价带尾部中的空穴的复合定义。已确定,在Cu(In,Ga)Se 2的带隙中形成的离子诱导受体缺陷的深能级下,非平衡电荷载流子的辐射复合定义了在能量0.92和〜0.77 eV处具有最大值的宽带。合金。讨论了在表面多晶Cu(In,Ga)Se 2薄膜中和表面上悬空电子键的离子钝化作用的条件,结构点缺陷的性质以及辐射复合的机理。

更新日期:2021-02-19
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