In the search for thermal management of advanced avionics packaging, materials such as eutectic liquid metal (LM) alloys and synthetic ceramics with superior thermophysical properties offer reliable and effective solutions. Conductive ceramic tubes can be used to contain LM as a coolant for heat exchangers. However, conductive ceramics will still need to be combined with metals to provide optimal thermal and structural performances. Additive manufacturing (AM) technologies have also shown they can facilitate novel approaches for fabricating efficient multi-material structures. Recently, we developed an in situ AM approach for embedding prefabricated components, such as ceramic tubes, inside a metallic block without parting surfaces for better sealing and more intimate contact between the metal and ceramic. In this selective laser sintering (SLS) approach, metal powders are melted near embedded ceramic tubes to close interfacial gaps associated with surface roughness and machining tolerances, resulting in a contact resistance at the metal–ceramic interface that is reduced relative to conventional packaging approaches. In this paper, we demonstrate how metallic cold plates can be fabricated with improved power dissipation by encapsulating highly conductive ceramic tubes with a SLS metal structure. To optimize the adhesion of the melt pool, the surface of the ceramics is electroplated to reduce surface defects and chemistry in order to improve the wettability of the ceramic. Experimental results of the cold plate prototypes fabricated by in situ AM technique revealed up to a 1.6× improvement in heat transfer compared to cold plates packaged by a conventional assembly technique, and results are validated through further numerical and analytical approaches.

在寻求高级航空电子设备包装的热管理时，具有良好热物理性能的低共熔液态金属（LM）合金和合成陶瓷等材料提供了可靠而有效的解决方案。导电陶瓷管可用于容纳LM作为热交换器的冷却剂。然而，导电陶瓷仍将需要与金属结合以提供最佳的热性能和结构性能。增材制造（AM）技术还表明，它们可以促进制造高效多材料结构的新颖方法。最近，我们开发了一种原位AM方法，用于将预制组件（例如陶瓷管）嵌入金属块内，而无需分离表面，以实现更好的密封以及金属和陶瓷之间更紧密的接触。在这种选择性激光烧结（SLS）方法中，金属粉末在嵌入式陶瓷管附近熔化，以封闭与表面粗糙度和加工公差相关的界面间隙，从而导致金属-陶瓷界面的接触电阻相对于传统包装方法得以降低。在本文中，我们演示了如何通过封装具有SLS金属结构的高导电陶瓷管来制造金属散热板，从而提高功耗。为了优化熔池的附着力，对陶瓷表面进行电镀以减少表面缺陷和化学反应，从而提高陶瓷的可湿性。通过原位AM技术制造的冷板原型的实验结果显示高达1。