KDP crystal is an important functional crystal material used in the fields of laser frequency conversion. Slicing is the first process of KDP crystal processing and the KDP crystal is usually sliced by the diamond wire saw. As KDP crystal is an anisotropic material, the properties of KDP contact with different diamond grits on the diamond wire saw during slicing would be different. The anisotropic properties may lead to the deviation of the diamond wire saw in the thickness direction and form the surface shape deviation of slice. The surface shape deviation would affect the amount of material to be removed and the accuracy of crystal positioning. The commonly used crystal planes of KDP crystal are the (001), the double-frequency, and the triple-frequency crystal plane. In this paper, a model of diamond wire saw considering the anisotropy of KDP crystal is established to obtain the sawing forces, while the anisotropic properties of KDP crystal used in slicing are obtained through coordinate changes. The obtained sawing forces are then applied to the diamond wire saw to obtain the surface shape deviation. Besides, the influence of the tension force on the surface shape deviation is also considered. Based on the established model, the variation rule of surface shape deviation with the feed angle of diamond wire saw is obtained. Results in this paper can reduce the surface shape deviation of slice caused by the anisotropic properties of KDP crystal.

KDP晶体是在激光频率转换领域中使用的重要的功能晶体材料。切片是KDP晶体加工的第一步，通常用金刚石线锯将KDP晶体切片。由于KDP晶体是各向异性材料，因此在切片过程中，KDP与金刚石线锯上的不同金刚石磨粒接触的特性将有所不同。各向异性可能导致金刚石线锯在厚度方向上的偏差，并形成切片的表面形状偏差。表面形状的偏差会影响要去除的材料量和晶体定位的精度。KDP晶体的常用晶面是（001），双频和三频晶面。在本文中，建立了考虑KDP晶体各向异性的金刚石线锯模型以获得锯切力，同时通过坐标变化获得了用于切片的KDP晶体的各向异性。然后将获得的锯切力施加到金刚石线锯上，以获得表面形状偏差。此外，还考虑了张力对表面形状偏差的影响。在建立的模型的基础上，得出了金刚石线锯的表面形状随进给角的变化规律。本文的结果可以减少由KDP晶体的各向异性引起的切片表面形状偏差。然后将获得的锯切力施加到金刚石线锯上，以获得表面形状偏差。此外，还考虑了张力对表面形状偏差的影响。在建立的模型的基础上，得出了金刚石线锯的表面形状随进给角的变化规律。本文的结果可以减少由KDP晶体的各向异性引起的切片表面形状偏差。然后将获得的锯切力施加到金刚石线锯上，以获得表面形状偏差。此外，还考虑了张力对表面形状偏差的影响。在建立的模型的基础上，得出了金刚石线锯的表面形状随进给角的变化规律。本文的结果可以减少由KDP晶体的各向异性引起的切片表面形状偏差。