Purpose

This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element.

Design/methodology/approach

A composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied.

Findings

Experimental results showed that only the IMC Ni₃Sn₄ was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements.

Originality/value

The similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate.

中文翻译：

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Ni颗粒增强剂与液态Sn基共晶焊料之间的界面反应

目的

本文旨在推导出液态锡基焊料与镍颗粒增强剂反应形成的金属间化合物（IMC）层的生长动力学模型，并与实验数据进行比较，以验证锡浓度和合金元素的影响。

设计/方法/方法

复合焊料是通过将 Ni 颗粒增强材料机械地引入焊料基质中来制造的。研究了非反应性合金元素 Ag、Pb 和 Bi 对液态 Sn 基共晶焊料和 Ni 颗粒之间形成的 IMC 生长动力学的影响，该复合焊料在 250°C–280°C 下反应。

发现

实验结果表明，只有IMC Ni ₃ Sn ₄作为反应产物存在。使用扩散控制的反应机制，通过比较使用四种不同焊料与不同浓度的 Sn 和合金元素获得的动力学数据，推导出并验证了量化 Sn 浓度和合金元素影响的动力学方程。

原创性/价值

这四种焊料的活化能之间的相似性证实了 Sn 原子通过 IMC 的扩散是速率控制步骤。此外，动力学值与 Ni 的几何形状无关，无论是球形颗粒还是平面基材。