The purpose of this paper is to deeply study the actual contact state of sealed relay contact surface, restore the contact spots of contact pair, and make up for the deficiency of establishing contact model of contact pair only by theoretical simulation. In this paper, the electrical contact high‐speed camera system is selected to record the kinematic parameters during the pull‐in process of the contact, and the deflection angle and deformation amount when the contact is complete are calculated. The surface height of the contact surface is collected through the non‐contact morphology scanner, and the actual contact morphology is corrected and restored. Finally, the actual contact spots are analyzed by reconstructing the contact difference‐plane. The method studied in this paper can provide a reference for the further study of contact analysis. Establishing the actual contact state of the contact pair of the micro level has a certain guiding role in the establishment of the contact resistance model. © 2021 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

中文翻译：

---

基于接触差平面的密封继电器接触对接触点分析

本文的目的是深入研究密封继电器触点表面的实际接触状态，恢复触点对的接触点，弥补理论上仅建立触点对接触模型的不足。在本文中，选择了电接触高速相机系统来记录接触引入过程中的运动学参数，并计算出接触完成后的偏转角和变形量。通过非接触形态扫描仪收集接触表面的表面高度，并校正和恢复实际的接触形态。最后，通过重建接触差平面来分析实际接触点。本文研究的方法可为进一步研究接触分析提供参考。建立微型接触对的实际接触状态对建立接触电阻模型具有一定的指导作用。©2021日本电气工程师学会。由Wiley Periodicals LLC发布。