The effects of ultrasonic-assisted soldering parameters on the interfacial microstructural evolution and shear strength of designed Al/Sn–9.77Zn–11.36Bi–1.46Ag/Cu solder joints were investigated. The ultrasonic-assisted soldering process promoted the dissolution of Al substrate and roughed Al/solder interface, which improved the pinning effect of Sn–9.77Zn–11.36Bi–1.46Ag on Al substrate. With an increasing ultrasonic soldering temperature, time and power, more Al atoms dissolved from Al substrate and migrated across solder to the opposite Cu substrate to form Al-rich (Zn) solid solutions. Consequently, Al_4.2Cu_3.2Zn_0.7 formed between ϵ-AgZn₃ and Cu₅Zn₈ layers at Cu substrate, resulting in thinner Cu₅Zn₈ and higher shear strength of solder joints. The highest shear strength of solder joints (38.6 MPa) was achieved after ultrasonic-assisted soldering at 300°C for 10 s under 9 W.

研究了超声辅助焊接参数对设计的Al / Sn–9.77Zn–11.36Bi–1.46Ag / Cu焊接接头的界面微结构演变和剪切强度的影响。超声辅助焊接过程促进了Al基体的溶解和粗糙的Al /焊料界面，从而改善了Sn–9.77Zn–11.36Bi–1.46Ag在Al基体上的固定效果。随着超声波焊接温度，时间和功率的增加，更多的Al原子从Al基板溶解并迁移穿过焊料到达相对的Cu基板，从而形成富Al（Zn）固溶体。因此，在ϵ-AgZn ₃和Cu ₅ Zn ₈之间形成了Al _4.2 Cu _3.2 Zn _0.7。铜层上的铜层，使铜₅锌_8的厚度更薄，焊点的剪切强度更高。超声波辅助焊接在300°C下，9 W下进行10 s后，焊点的剪切强度最高（38.6 MPa）。