Thermal management is a crucial aspect of electronic assemblies and simulations are playing an important role in decision making during the design phase. For an electronic control unit (ECU), the main heat generating sources are the electronic components soldered on the printed circuit board (PCB). Creating high quality thermal models for the associated components, required in the assembly level simulations, is an ongoing challenge in many industries. While there are well-established measuring methods of the thermal response of a component, mirroring this response in a virtual representation is still challenging. The most common approach is by using structure function transformations of thermal impedance (Z_th) curves and identifying corresponding thermal resistance and capacitance for each layer in a component. Although well-known and reliable, this approach involves a time-consuming manual, iterative approach. An alternative approach, using optimization software, which directly compares Z_th curves and adjusts the properties of the model is studied and compared to the iterative approach. These methods are presented for the FEM modelling of a MOSFET in D2PAK (TO-263) package, highlighting the advantages of using direct Z_th comparison and optimization in an automated manner.

热管理是电子装配的关键方面，在设计阶段，仿真在决策中起着重要作用。对于电子控制单元（ECU），主要的发热源是焊接在印刷电路板（PCB）上的电子组件。在装配水平仿真中需要为关联的零件创建高质量的热模型，这在许多行业中都是一个持续的挑战。尽管存在完善的组件热响应测量方法，但以虚拟表示方式反映该响应仍然具有挑战性。最常见的方法是使用热阻抗（Z _th）曲线，并确定组件中每一层的相应热阻和电容。尽管众所周知且可靠，但是此方法涉及耗时的手动迭代方法。研究了一种使用优化软件的方法，该方法可以直接比较_第Z条曲线并调整模型的属性，并将其与迭代方法进行比较。提出了这些方法用于D2PAK（TO-263）封装的MOSFET的FEM建模，突出了使用直接_Zth比较和自动方式进行优化的优势。