This paper presents the simulation and hardware test results for determining the fatigue life of the solder joints of a printed circuit board (PCB) including a DC to AC inverter circuit with six power metal oxide semiconductor field effect transistors (MOSFETs) by using the finite element method (FEM) under different vibration effects. This board is exposed under different angles by a vibration machine. The selected angles were performed on the power module to find the maximum stress points of the power module for different vibration frequencies. The results indicate that the maximum stress is observed at the corners of the solder layer. The stress of the solder joints significantly increases when the input frequency increases, and the failure, voids generation and crack formation and propagation are more observable under this condition. Furthermore, the loading direction changes show that the peeling stress of the solder layer is directly affected by lower angles. The shear stress occurs in lower angles of loading directions, and this situation results in the peeling stress. The simulation investigations are proved by the experimental results in the study. According to the observations, the fatigue effects result in the coalescence and the void growths in lower angles of vibration loadings. The paper also investigates the normal loading condition of the power inverter circuit, and the highest reliability is obtained compared to all other experimental tests.

本文介绍了用于确定印刷电路板（PCB）焊点疲劳寿命的仿真和硬件测试结果，该电路板包括使用有限元的六个功率金属氧化物半导体场效应晶体管（MOSFET）的DC到AC逆变器电路方法（FEM）在不同的振动作用下。该板被振动机以不同角度暴露。在电源模块上执行选定的角度，以找到针对不同振动频率的电源模块的最大应力点。结果表明，在焊料层的拐角处观察到最大应力。当输入频率增加时，焊点的应力会显着增加，在这种情况下更容易观察到失效，空洞的产生以及裂纹的形成和扩展。此外，加载方向的变化表明，焊料层的剥离应力直接受到较小角度的影响。剪切应力出现在加载方向的较小角度，这种情况会导致剥离应力。实验结果证明了仿真研究的正确性。根据观察，疲劳效应导致在较小的振动载荷角度下会聚结并产生空隙。本文还研究了电源逆变器电路的正常负载情况，与所有其他实验测试相比，它获得了最高的可靠性。这种情况会导致剥离应力。实验结果证明了仿真研究的正确性。根据观察，疲劳效应导致在较小的振动载荷角度下会聚结并产生空隙。本文还研究了电源逆变器电路的正常负载情况，与所有其他实验测试相比，它获得了最高的可靠性。这种情况会导致剥离应力。实验结果证明了仿真研究的正确性。根据观察，疲劳效应导致在较小的振动载荷角度下会聚结并产生空隙。本文还研究了电源逆变器电路的正常负载情况，与所有其他实验测试相比，它获得了最高的可靠性。