A recently developed novel methodology for electromigration (EM) failure assessment in power/ground grids of integrated circuits is employed in the electronic design automation tool prototype. The tool performs the analysis of stress evolution in interconnect trees for detecting EM-induced voiding locations and tracks resistance increase in the voided wires based on a physics-based model of voiding kinetics. Increased resistances of the branches of power/ground networks lead to a voltage drop increase in grid nodes. The instance in time when a designer-specified voltage-drop threshold is reached defines the EM-induced time-to-failure. Monte-Carlo simulation, performed around the core engine that simulates the stress over time using randomly generated atomic diffusivities and critical stress values, leads to the mean-time-to-failure of the grid, along with voiding probabilities of the interconnect branches.

中文翻译：

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用于商业级电力输送网络中电迁移评估的新型基于物理学的工具原型

电子设计自动化工具原型中采用了一种最新开发的新颖方法来评估集成电路的电源/接地网格中的电迁移（EM）故障。该工具基于互连动力学模型基于物理学的模型，对互连树中的应力演化进行分析，以检测EM引起的空隙位置，并跟踪空隙导线中的电阻增加。电力/地面网络分支的电阻增加导致电网节点的压降增加。达到设计者指定的压降阈值的时间实例定义了EM引起的故障时间。在核心引擎周围执行的蒙特卡洛模拟，使用随机生成的原子扩散率和临界应力值模拟随时间变化的应力，从而得出网格的平均失效时间，