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Thermoplastic bonding of TC4 and 316L stainless steel with a Ti-based bulk metallic glass as the filler metal
Journal of Materials Research and Technology ( IF 6.4 ) Pub Date : 2021-01-17 , DOI: 10.1016/j.jmrt.2021.01.042
K.W. Dong , J. Kong , Y. Peng , Q. Zhou , K.H. Wang

Dissimilar TC4 titanium alloy and 316L stainless steel were successfully joined utilizing thermoplastic bonding (TPB) with a Ti-based bulk metallic glass (BMG) as the filler. Good physical pre-bonding and metallurgical bonding were successively achieved through superplastic flowing in the superliquid region and solid-sate atomic diffusion and reaction. The experimental results indicated that the superplastic flow of BMG in the superliquid region greatly promoted void shrinkage in the interfaces. Hence, a compact contacting was obtained at temperature much lower than the melting point of the filler metal, which is beneficial to the atomic diffusion between the filler metal and base metals as temperature increased. After holding for some time below the melting point of the filler metal, three different reaction layers derived from the atomic diffusion and reaction between the base metal and filler metal were formed in the interfacial regions. A series of irregular bulky and small plate-shaped fine phases were formed and uniformly distributed in the interfacial regions and intermediate region. The shearing tests showed that a high strength of 225 MPa was obtained after diffusing at 695 °C for 60min. The fracture surface of the joint shifted from the 316L interface to then central crystallization layer as temperature increased.



中文翻译:

TC4和316L不锈钢与Ti基块状金属玻璃作为填充金属的热塑性结合

异种TC4钛合金和316L不锈钢通过热塑性粘结(TPB)和以钛为基的块状金属玻璃(BMG)作为填充剂成功地结合在一起。通过在超液体区域的超塑性流动以及固相原子扩散和反应,相继实现了良好的物理预键合和冶金键合。实验结果表明,BMG在超液体区域的超塑性流动大大促进了界面处的空隙收缩。因此,在远低于填充金属的熔点的温度下获得紧密的接触,这有利于随着温度的升高填充金属与贱金属之间的原子扩散。保持低于填充金属的熔点一段时间后,在界面区域中形成了由原子扩散和贱金属与填充金属之间的反应衍生的三个不同的反应层。形成了一系列不规则的块状和小板状细相,并均匀分布在界面区域和中间区域。剪切试验表明,在695°C扩散60分钟后,可获得225 MPa的高强度。随着温度升高,接头的断裂表面从316L界面转移到中央结晶层。剪切试验表明,在695°C扩散60分钟后,可获得225 MPa的高强度。随着温度升高,接头的断裂表面从316L界面转移到中央结晶层。剪切试验表明,在695°C扩散60分钟后,可获得225 MPa的高强度。随着温度升高,接头的断裂表面从316L界面转移到中央结晶层。

更新日期:2021-01-29
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