Sol–gel formulations were applied to replace silicone as matrix material for phosphors in pc-LEDs. The content of organic groups was minimized in order to reduce yellowing during the operation of the elements. It was possible to evenly embed YAG:Ce particles in sol–gel binders. Further processing on LED chips resulted in operational light sources; and their performance was compared to standard silicone-based elements. Additional deposition of ALD laminates seals possible defects within the sol–gel matrix as additional protection of the phosphors and the underlying LEDs.

中文翻译：

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pc-LED中YAG：Ce荧光粉的溶胶-凝胶基质

溶胶-凝胶配方被用来代替有机硅作为PC-LED中磷光体的基质材料。为了减少在元件操作过程中的泛黄，使有机基团的含量最小化。可以将YAG：Ce颗粒均匀地嵌入溶胶-凝胶粘合剂中。对LED芯片的进一步处理产生了工作光源；并将其性能与标准的有机硅基元素进行了比较。ALD层压板的额外沉积可密封溶胶-凝胶基质中可能存在的缺陷，从而为磷光体和下方的LED提供额外的保护。