Abstract

The effect of pH value on the electroless deposition of copper coated graphite powders (Cu@GPs) was investigated in this paper. The cathodic and anodic polarization curves were determined by linear sweep voltammetry in the plating at various pH value. pH value increasing can reduce the initial oxidation potential of formaldehyde, increase peak current density and accelerate electroless copper nuclei generated by the reduction reaction. With increasing pH value Cu+ disproportionation reaction was inhibited. Through the complexation competition and discharge competition among them, Na₂EDTA, –OH and TART affect the reduction of cupric ions. The increasing pH value promote the formation of copper nuclei on the surface of graphite powders. Uniform Cu@GPs were fabricated by optimizing the pH 12.5~13. The copper plating layer is tightly combined with graphite, and the coating is complete.

中文翻译：

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pH值对石墨铜粉化学沉积的影响

摘要

研究了pH值对铜包覆石墨粉（Cu @ GPs）化学沉积的影响。通过线性扫描伏安法在各种pH值条件下测定镀层的阴极和阳极极化曲线。pH值的增加可以降低甲醛的初始氧化电位，增加峰值电流密度，并加速还原反应生成的化学铜核。随着pH值的增加，Cu +歧化反应受到抑制。通过它们之间的络合竞争和放电竞争，Na ₂EDTA，-OH和TART影响铜离子的还原。pH值的增加促进了石墨粉表面铜核的形成。通过优化pH 12.5〜13可以制备出均一的Cu @ GPs。镀铜层与石墨紧密结合，涂层完成。