With the continuing downscaling in feature sizes, the thermal impact on material properties and geometrical deformations can no longer be ignored in the analysis of the electromagnetic compatibility or electromagnetic interference of package systems, including System-in-Package and antenna arrays. We present a high-performance numerical simulation program that is intended to perform large-scale multiphysics simulations using the finite element method. An efficient domain decomposition method was developed to accelerate the multiphysics loops of electromagnetic–thermal stress simulations by considering the fact that the electromagnetic field perturbations caused by geometrical deformation are small and constrained in one or a few subdomains. The multi-level parallelism of the algorithm was also obtained based on an in-house developed parallel infrastructure. Numerical examples showed that our algorithm is able to enable simulation with multiple processors in parallel and, more importantly, achieve a significant reduction in computation time compared with traditional methods.

中文翻译：

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使用有效域分解方法的包装系统并行多物理场仿真

随着特征尺寸的持续缩小，在分析包括系统级封装和天线阵列在内的封装系统的电磁兼容性或电磁干扰时，对材料特性和几何变形的热影响将不再被忽略。我们提出了一种高性能的数值模拟程序，旨在使用有限元方法进行大规模的多物理场模拟。考虑到由几何变形引起的电磁场扰动很小并且限制在一个或几个子域中的事实，因此开发了一种有效的域分解方法来加速电磁-热应力模拟的多物理场循环。还基于内部开发的并行基础结构获得了该算法的多级并行性。数值算例表明，我们的算法能够并行使用多个处理器进行仿真，更重要的是，与传统方法相比，该算法可显着减少计算时间。