Disassembly sequence planning (DSP) has gained active research interest since the 90s due to increasing environmental awareness and stricter regulations regarding end-of-life (EOL) strategies of used products. DSP is a subset of disassembly research that focuses on the systematic separation of constituent parts in a product. Despite tremendous efforts from researchers worldwide, DSP remains a challenging research area due to a variety of reasons, e.g. vast variety and complexity of products and uncertainties in the EOL conditions of products. Numerous survey papers have been published from time to time to offer up-to-date insights into this field. Researchers have continuously proposed new solutions to solve the DSP problem in tandem with the advancements in computing and the introduction of new concepts, such as virtual reality. This paper aims to provide a state-of-the-art survey of DSP research in the last 12 years. The research progress and achievements in DSP are summarised from three perspectives, namely, product representation models, sequencing algorithms and methodology validation. Lastly, the challenges and potential research directions in DSP are elaborated followed by conclusion.

自20世纪90年代以来，由于对环境的了解不断提高，并且对二手产品的寿命终止（EOL）策略提出了更严格的规定，拆卸序列计划（DSP）引起了人们的积极研究。DSP是拆卸研究的子集，其研究重点是产品中组成部分的系统分离。尽管全球研究人员付出了巨大的努力，但由于多种原因，DSP仍然是一个充满挑战的研究领域，例如，产品种类繁多，复杂，产品的EOL条件不确定。不时发布许多调查论文，以提供有关该领域的最新见解。随着计算的进步和虚拟现实等新概念的引入，研究人员不断提出新的解决方案来解决DSP问题。本文旨在提供过去12年中最新的DSP研究概况。从产品表示模型，排序算法和方法论验证三个方面总结了DSP的研究进展和成就。最后，阐述了DSP面临的挑战和潜在的研究方向。