当前位置: X-MOL 学术Microelectron. Reliab. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
The influence of glass particle size on the interfacial bonding strength of Au/ceramic co-fired structure
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2021-01-13 , DOI: 10.1016/j.microrel.2021.114039
Tingnan Yan , Weijun Zhang , Xingyu Chen , Fenglin Wang , Zhuofeng Liu

Gold electrode is preferable in extreme environments, but few reports focus on gold electrode for LTCC application. In this article, CaO–B2O3–SiO2 glass powder used in the gold paste with different particle size was prepared. The sintering shrinkage behavior of CaO–B2O3–SiO2 green tapes and gold paste were investigated. The blisters of gold electrode and corresponding mechanism during sintering process were studied. The sheet resistivity and wire bonding strength of gold electrode were connected with glass particle size strongly. When the D50 of CaO–B2O3–SiO2 glass powder was 2.61 μm, the wire bonding performance of gold electrode was excellent, of which the average strengths and standard deviation of wire bonding were 10.30 g and 0.66 g, respectively. These results would have a positive effect on guiding the select of glass particle size in gold paste.



中文翻译:

玻璃粒径对金/陶瓷共烧结构界面结合强度的影响

金电极在极端环境中是可取的,但很少有报道关注用于LTCC应用的金电极。本文制备了粒径不同的金浆中使用的CaO–B 2 O 3 –SiO 2玻璃粉。研究了CaO–B 2 O 3 –SiO 2绿带和金浆的烧结收缩行为。研究了金电极在烧结过程中的起泡现象及机理。金电极的薄层电阻率和引线键合强度与玻璃粒径密切相关。当CaO–B 2 O 3 –SiO 2的D 50玻璃粉末为2.61μm,金电极的引线键合性能优异,其中引线键合的平均强度和标准偏差分别为10.30g和0.66g。这些结果将对指导选择金浆中的玻璃粒度具有积极的作用。

更新日期:2021-01-13
down
wechat
bug