ABSTRACT

A new approach is used to model transient liquid phase (TLP) bonding without the simplification assumption of one-dimensional solid–liquid interface migration. In contrast to the general assumption that the single parameter, Φ, that is often used to represent the isothermal solidification kinetics during TLP bonding is constant, this work reports for the first time by coupled numerical simulation and experimental verification that a condition exists where Φ becomes a variable parameter that increases with time. This unique isothermal solidification kinetics behaviour is attributable to a combination of two-dimensional migration of the solid–liquid interface and solute diffusion in a direction along the increase in radius of curvature.

摘要

一种新方法用于建模瞬态液相（TLP）键，而无需一维固-液界面迁移的简化假设。与通常用于表示TLP键合过程中的等温凝固动力学的单个参数Φ的一般假设相反，该工作首次通过数值模拟和实验验证相结合的方法首次报道了Φ变为随时间增加的可变参数。这种独特的等温凝固动力学行为归因于固液界面的二维迁移和溶质沿曲率半径增加的方向的扩散。