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Influence of porosity and impurities on the thermal conductivity of pressure-less sintered Cu powder green bodies
Powder Metallurgy ( IF 1.4 ) Pub Date : 2021-01-10
Jonas Ott, Andreas Burghardt, Dominik Britz, Frank Mücklich

ABSTRACT

Copper as a material with a high electrical and thermal conductivity awakes large interest for many applications in industry, e.g. thermal management of electronic components. Powder-based manufacturing techniques (e.g. Selective Laser Melting, Binder Jetting, Fused Filament Fabrication and Metal Injection Molding) enable the complex shaping of metals. Especially the methods without melting processes like Binder Jetting, Fused Filament Fabrication and Metal Injection Molding have a great potential for complex Cu structures. These techniques built up a powder-based green body and require a subsequent sintering step to reach a high density with maximum properties. This work reports the development of the heat conductivity during pressure-less sintering of Cu powder green bodies. The experimental results are compared to analytical models and a numerical simulation and show the limits of the reachable heat conductivity depending on the remaining porosity and the impurity concentration.



中文翻译:

孔隙和杂质对无压烧结铜粉生坯热导率的影响

摘要

铜作为具有高电导率和导热率的材料引起了工业中许多应用的广泛兴趣,例如电子组件的热管理。基于粉末的制造技术(例如,选择性激光熔化,粘结剂喷射,熔融长丝加工和金属注射成型)使金属的复杂成型成为可能。特别是没有熔融工艺的方法,如粘结剂喷射,熔融长丝制造和金属注射成型,对于复杂的铜结构具有巨大的潜力。这些技术建立了粉末基生坯,并且需要随后的烧结步骤以达到具有最大性能的高密度。这项工作报道了在无压烧结铜粉生坯过程中导热性的发展。

更新日期:2021-01-11
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