Electromagnetic interference (EMI) shielding materials with ultrathin, flexible, superior mechanical and thermal management properties are highly desirable for smart and wearable electronics. Here, ultrathin and flexible Ni/Cu/metallic glass/Cu/Ni (Ni/Cu/MG) multilayer composite with alternate magnetic and electrical structures was designed via facial electroless plating of Cu and Ni on an Fe-based metallic glass. The resultant 0.02 mm-thick Ni/Cu/MG composite displays a superior EMI shielding effectiveness (EMI SE) of 35 dB and a great EMI SE/t of 1750 dB/mm, which is greater than those of composites with monotonous multilayer or homogeneous structures. The improved EMI SE originates from the massive ohmic losses, the enhanced internal reflection/absorption, and the abundant interfacial polarization loss. Particularly, Ni/Cu/MG exhibits a high tensile strength of up to 1.2 GPa and outstanding mechanical stability, enabling the EMI SE remains unchanged after 10,000 times of bending. Moreover, Ni/Cu/MG has excellent Joule heating characteristics and thermal stability, which is very suitable for heating components of wearable hyperthermia devices.

具有超薄，柔性，卓越的机械和热管理特性的电磁干扰（EMI）屏蔽材料是智能和可穿戴电子设备的极高需求。在这里，通过在Fe基金属玻璃上进行Cu和Ni的表面化学镀，设计了具有交替的磁和电结构的超薄且柔性的Ni / Cu /金属玻璃/ Cu / Ni（Ni / Cu / MG）多层复合材料。所得的0.02毫米厚的Ni / Cu / MG复合材料显示出35 dB的出色EMI屏蔽效果（EMI SE）和1750 dB / mm的EMI SE / t，这比具有单调多层或均质材料的复合材料要高。结构。EMI SE的改善源自大量的欧姆损耗，增强的内部反射/吸收以及丰富的界面极化损耗。尤其，Ni / Cu / MG表现出高达1.2 GPa的高抗拉强度和出色的机械稳定性，使得EMI SE在弯曲10,000次后仍保持不变。此外，Ni / Cu / MG具有出色的焦耳加热特性和热稳定性，非常适合加热可穿戴热疗设备的组件。