The reduction of copper oxide by isopropyl alcohol (IPA) gas and its mechanism were investigated toward the selective process of copper (Cu) wiring. Also, the decomposition behavior of IPA gas and surface modification during the IPA treatment on Cu and copper oxide surfaces were studied. Two samples were measured: Cu surface having native oxide film and a metal Cu surface after a hydrogen reduction treatment. The decomposition and reaction behaviors and adsorption characteristics of IPA were investigated using the inline evaluation system equipped with a Cu reactor and Fourier transform infrared spectroscopy. The chemical structures of the Cu and copper oxide surfaces before and after IPA treatment were analyzed by x-ray photoelectron spectroscopy. Based on the experiments, the process condition to induce reduction of copper oxide by IPA gas during the Cu processes temperature range was identified. It was also found that different organic matter derived from IPA was adsorbed on each surface.

中文翻译：

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通过异丙醇处理对铜和氧化铜表面态的改性，使其适用于区域选择性工艺

研究了异丙醇（IPA）气体对氧化铜的还原作用及其机理，旨在实现铜（Cu）布线的选择过程。此外，还研究了IPA气体在铜和氧化铜表面上的IPA气体的分解行为和IPA处理期间的表面改性。测量了两个样品：具有天然氧化膜的Cu表面和在氢还原处理之后的金属Cu表面。使用配有铜反应器和傅里叶变换红外光谱的在线评估系统，研究了IPA的分解，反应行为和吸附特性。通过X射线光电子能谱分析了IPA处理前后的铜和氧化铜表面的化学结构。根据实验，确定了在Cu工艺温度范围内诱导IPA气体还原氧化铜的工艺条件。还发现，来自IPA的不同有机物被吸附在每个表面上。