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Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate
Metals ( IF 2.9 ) Pub Date : 2021-01-08 , DOI: 10.3390/met11010111
Ivana O. Mladenović , Nebojša D. Nikolić , Jelena S. Lamovec , Dana Vasiljević-Radović , Vesna Radojević

The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 µm thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm−2, and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418–1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the “soft film on hard substrate” composite hardness system. The obtained stress exponents in the 4.35–7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.

中文翻译:

复合硬度模型在电解沉积铜镀层力学性能分析中的应用:基体类型的影响

电化学沉积铜涂层的机械特性已经通过应用两种硬度复合模型进行了检验:Chicot-Lesage(CL)模型和Cheng-Gao(CG)模型。将10、20、40和60 µm厚的细晶粒铜涂层通过脉动电流(PC)的方式以50 mA cm -2的平均电流密度电沉积在黄铜上,并通过扫描电子(SEM),原子力(AFM)和光学(OM)显微镜进行了表征。通过使用CL模型,我们确定了极限相对压痕深度(RID)值,该值将涂层硬度的区域与基材对测量的复合硬度的强烈影响相分离。通过CG模型获得的在0.9418–1.1399 GPa范围内的涂层硬度值证实了以下假设:黄铜上的Cu涂层属于“硬质基材上的软膜”复合硬度体系。在0.49 N的外加载荷下获得的应力指数在4.35–7.69范围内,表明主要的蠕变机理是位错蠕变和位错爬升。将所获得的机械特性与最近在Si(111)基板上获得的机械特性进行比较,
更新日期:2021-01-08
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