In this work, a novel thermal conductive and electrical insulation h‐BN@AgNPs/ANFs composite paper was fabricated by vacuum‐assisted filtration approach. Specifically, hexagonal boron nitride (h‐BN) was incorporated via polydopamine pretreatment and subsequent decoration by silver nanoparticles, which served as bridges to link neighboring h‐BN sheets. The results revealed that the thermal conductivity of as‐prepared composite paper increased to 1.032 W/m K with 40 wt% filler loading, about 464% higher than the pure ANFs paper, which was attributed to the efficient thermal conductive networks within the paper and strong interfacial combination through hydrogen bonding. Besides, the as‐prepared composite paper exhibited excellent mechanical property with the maximum tensile strength over 90 MPa, and good electrical insulation performance. More importantly, this work provided a promising strategy to achieve high thermal conductivity ANFs based composite paper by constructing efficient thermal conductive networks, which had potential to be used in the field of electronic packaging.

中文翻译：

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迈向高导热芳族聚酰胺纳米纤维纸：掺入由银纳米颗粒桥接的六方氮化硼

在这项工作中，通过真空辅助过滤方法制备了一种新型的导热和电绝缘的h-BN @ AgNPs / ANFs复合纸。具体来说，六方氮化硼（h-BN）通过聚多巴胺预处理并随后通过银纳米颗粒进行装饰而结合在一起，而银纳米颗粒充当连接相邻h-BN片材的桥梁。结果表明，制备的复合纸的热导率在填料含量为40 wt％的情况下提高到1.032 W / m K，比纯ANFs纸高约464％，这归因于纸中有效的导热网络和通过氢键形成牢固的界面结合。此外，所制备的复合纸表现出优异的机械性能，最大抗拉强度超过90 MPa，并且具有良好的电绝缘性能。